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Flex cable with connectors ( with UI board ) Nokia N85 ( original )
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Tape ( with SD card reader , microphone ) LG GD880 ( original )
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UI board ( function ) Sony Ericsson W760i - with flex cable ( original )
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Flex cable Samsung C250 ( original )
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Flex cable Samsung i620 ( original )
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Flex cable Samsung i450 ( original )
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Flex cable Sony Ericsson K800 - with flash ( original )
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Flex cable HD Nokia 5700 ( original )
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Cover ( Front ) Nokia N91 - silver ( original )
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Battery cover Sony Ericsson C510 - silver ( original )
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Cover Nokia 7200 - CC - 180D - black ( original )
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Front cover LG KE820 ( original )
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Bottomcover Nokia C5 - 03 - grey ( original )
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Middlecover Nokia 5530x - white ( original )
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Cover ( Front ) Sony Ericsson J105i - red ( original )
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Cover ( Front ) Nokia N70 - creme ( original )
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BGA Planting Kit A - B
Price = 8.97 EUR
(without VAT)
Weight = 0.01 kg
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Description: BGA Planting Kit A - B
Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, Motorola
Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
This set can work with 6 different chips. Description of each chip is in manual.
List of supported chips:
- Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar...
- CPU do SE T230, T610, T630 and similar...
- Dialog do Siemensow serii x65 and similar...
- CPU Siemens C55, C60, MC60 and similar...
- UEM in Nokia phones
- CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar...
- and more (see all chips in manual link)
In set:
- Planting plate
- Description
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